● Product Name
Solder Bar for Wave
Product No.
Classification
Composition
Melting Point (℃)
Soldering Temp(℃)
Features
2C07
Sn-Cu계
Sn0.7Cu (α)
227/227
260±5
- Minimal Dross
- Minimal Pad Erosion
- High Reliability
3N06
Sn0.5Cu0.06Ni (α)
220/233
2N06
Sn0.06Ni (α)
230/233
4A03
Sn0.7Cu0.3Ag (α)
221/227
2S50
Sn-Sb계
Sn5Sb
232/240
270±5
3C05
Sn-Ag계
Sn3Ag0.5Cu
217/217
255±5
- Excellent erosion resistance and spreadability
5A35
Sn3.5(3)Ag0.5Cu (Ni, Ge)
High Temperature Solder Bar for Dipping
Melting Point
3C30
Sn3Cu (α)
227/312
350±10
- Minimal dross generation
- Minimal Oxidant
- Excellent Joinability
3C40
Sn4Cu (α)
227/353
390±10
4C40
Sn4Cu0.05Ni (α)
Antioxidant for Pb Free
- 용융솔더 Dross를 극소화
- 접합강도 향상효과
- 젖음성 및 퍼짐성 개선
Use
Antiox α
Sn-Cu system
Antioxidant for wave
Antiox ß
Sn-Ag system
Antiox γ
Sn-Cu System
350~550
Antioxidant for dip
